JPH0376191B2 - - Google Patents

Info

Publication number
JPH0376191B2
JPH0376191B2 JP62033568A JP3356887A JPH0376191B2 JP H0376191 B2 JPH0376191 B2 JP H0376191B2 JP 62033568 A JP62033568 A JP 62033568A JP 3356887 A JP3356887 A JP 3356887A JP H0376191 B2 JPH0376191 B2 JP H0376191B2
Authority
JP
Japan
Prior art keywords
housing
viscous material
hole
substrate
piston
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62033568A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62201672A (ja
Inventor
Shoenzaraa Deiuitsudo
Uojishiku Zadeusu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of JPS62201672A publication Critical patent/JPS62201672A/ja
Publication of JPH0376191B2 publication Critical patent/JPH0376191B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP62033568A 1986-02-18 1987-02-18 粘性材料を分配するための方法および装置 Granted JPS62201672A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US829889 1986-02-18
US06/829,889 US4622239A (en) 1986-02-18 1986-02-18 Method and apparatus for dispensing viscous materials

Publications (2)

Publication Number Publication Date
JPS62201672A JPS62201672A (ja) 1987-09-05
JPH0376191B2 true JPH0376191B2 (en]) 1991-12-04

Family

ID=25255831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62033568A Granted JPS62201672A (ja) 1986-02-18 1987-02-18 粘性材料を分配するための方法および装置

Country Status (3)

Country Link
US (1) US4622239A (en])
JP (1) JPS62201672A (en])
CA (1) CA1258013A (en])

Families Citing this family (132)

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JP6495112B2 (ja) * 2015-06-02 2019-04-03 株式会社Ｆｕｊｉ はんだ供給装置
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Also Published As

Publication number Publication date
US4622239A (en) 1986-11-11
JPS62201672A (ja) 1987-09-05
CA1258013A (en) 1989-08-01

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